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Thinfilm has worldwide presence. Find us on the road.

 

Interpack 2014 – Processes and PackagingThinfilm Interpack logo

May 8-14, 2014, Messe Düsseldorf, Düsseldorf, Germany

www.interpack.com

As the world’s leading trade fair, it is the major inspiration for the packaging industry and all related process technologies.

2,700 exhibitors from more than 60 countries will present their latest ideas, innovate concepts and technological visions at interpack – not only in equipment and machinery for packaging and processing, but also in production tools for packaging materials, materials themselves, and services for the entire industry.

PEPSO Interpack Thinfilm

PEPSO Global is the new information platform for printed and organic electronics. Inform yourself about the newest trends and developments concerning printed electronics in the glass and solar industry, medical technology, retail technology, plastics industry and printing technology.

www.pepso-global.com

 

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LOPEC 2014 – International Exhibition and Conference LOPEC-Munich-Conference-logo
for the Printed Electronics Industry

May 26-28, 2014, Messe München, Munich, Germany

www.lopec.com

LOPEC is the leading international trade fair and conference for printed electronics in the high-tech business location of Munich. The exclusive business platform addresses manufacturers and users of a technology of the future across a wide range of industry sectors. It is innovative, flexible, cost-effective and thus suitable for mass-market production.

 

Previous events:

 

IDTechEx Printed Electronics Europe

Printed-Electronics-Europe-2014-IDTechEx

April 1-2, 2014, The Estrel Conference Center, Berlin, Germany

www.idtechex.com

More than 1,800 people will attend this event, now in its eleventh year, to aid their critical business and technology development strategy decisions in this emerging, high growth topic. This event focuses on the commercialization of Printed Electronics technology, covering broadly organic, inorganic, thin film and flexible nanotechnologies. To that end, we have some of the world’s largest user companies presenting on their needs and experience with printed electronics, and many are in attendance to learn how they can use these new technologies in their products.

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DnB Markets SME Conference 2014dnbnormarkets

April 8, 2014, Oslo, Norway

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IP Protect Expo 2014IP protect expo London logo

March 11 – 12, 2014, Business Design Centre, London, UK

www.ip-protectexpo.com

IP Protect Expo is a significant new event for the intellectual property industry. Hosted by ACG, the UK Anti-Counterfeiting Group (www.a-cg.org),and developed by brands. The 3rd Expo brings together intellectual property rights holders (brands, content owners and designers) from different industries, as well as law enforcement and intellectual property protection experts from around the world.

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2014 Post Davos Nordic SummitPost-Nordic-Davos-Stockholm

February 17, 2014, The Grand Hotel, Stockholm, Sweden

www.allready.net/pwcnordicsummit/

The Summit is organised by PricewaterhouseCoopers, in association with the World Economic Forum and will once again bring together a select group of 100 of the region’s leading CEOs, chairmen and senior politicians, as well as speakers from around the world. The theme of the World Economic Forum Annual Meeting 2014 is: “The Reshaping of the World: Consequences for Politics, Business and Society”.
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2014 Flexible & Printed Electronics Conference & Exhibitionlogo

February 4-6, 2014, Phoenix Convention Center, Phoenix, AZ, USA

www.flexconference.org

2014FLEX is a 4-day, multi-disciplinary event addressing global technical and business developments impacting the sector’s value and supply chains. The event draws over 600 professionals, representing 350 different organizations, for presentations, meetings, seminars and exhibits.

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ODDO Midcap Forumbaniere_uk

January 9-10, 2014, Lyon Convention Center, France

www.midcap-forum.com

The Oddo Midcap Forum is the largest event of its kind exclusively for European listed companies with a market capitalisation of up to € 12bn. During 2 days, 165 companies and 281 investors will gather in 3291 meetings.
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12th Anti-Counterfeiting & Brand Protection Anti Counterfeiting Brand Protection Summit West Coast Tradeshow logo
West Coast Summit

January 27-29, 2014, Golden Gateway Hotel, San Francisco, CA, USA

www.anticounterfeitingsummitwest.com

At the cross-industry 12th Anti-Counterfeiting & Brand Protection West Coast Summit in San Francisco, you’ll learn from Brand Protection leaders, Trademark Counsel, IP Counsel, Investigators, and many others. These leading experts are trying to cripple counterfeit networks by implemented holistic anti-counterfeiting strategies and partnering with law enforcement around the world.

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European Packaging Summit 2014

WTG events packaging summit

January 27-28, 2014, Maritim proArte Hotel, Berlin, Germany

www.eupacksummit.com

The European Packaging Summit 2014 offers you the opportunity to explore innovative packaging strategies to reduce costs, it also gives access to the latest developments in packaging materials plus highlights creative ideas proven to grow your brand through packaging design. Taking place between January 27th-28th 2014, the summit delivers pre-qualified one-to-one meetings, technical workshops, interactive roundtables and keynote sessions with thought-leaders speaking about

Kai Leppanen, Thinfilm’s VP Sales and Business Development Eruope, will present in the session “Packaging Innovation Showcase”