Thinfilm has worldwide presence. Find us on the road.
Interpack 2014 – Processes and Packaging
May 8-14, 2014, Messe Düsseldorf, Düsseldorf, Germany
As the world’s leading trade fair, it is the major inspiration for the packaging industry and all related process technologies.
2,700 exhibitors from more than 60 countries will present their latest ideas, innovate concepts and technological visions at interpack – not only in equipment and machinery for packaging and processing, but also in production tools for packaging materials, materials themselves, and services for the entire industry.
PEPSO Global is the new information platform for printed and organic electronics. Inform yourself about the newest trends and developments concerning printed electronics in the glass and solar industry, medical technology, retail technology, plastics industry and printing technology.
LOPEC 2014 – International Exhibition and Conference
for the Printed Electronics Industry
May 26-28, 2014, Messe München, Munich, Germany
LOPEC is the leading international trade fair and conference for printed electronics in the high-tech business location of Munich. The exclusive business platform addresses manufacturers and users of a technology of the future across a wide range of industry sectors. It is innovative, flexible, cost-effective and thus suitable for mass-market production.
IDTechEx Printed Electronics Europe
April 1-2, 2014, The Estrel Conference Center, Berlin, Germany
More than 1,800 people will attend this event, now in its eleventh year, to aid their critical business and technology development strategy decisions in this emerging, high growth topic. This event focuses on the commercialization of Printed Electronics technology, covering broadly organic, inorganic, thin film and flexible nanotechnologies. To that end, we have some of the world’s largest user companies presenting on their needs and experience with printed electronics, and many are in attendance to learn how they can use these new technologies in their products.
DnB Markets SME Conference 2014
April 8, 2014, Oslo, Norway
IP Protect Expo 2014
March 11 – 12, 2014, Business Design Centre, London, UK
IP Protect Expo is a significant new event for the intellectual property industry. Hosted by ACG, the UK Anti-Counterfeiting Group (www.a-cg.org),and developed by brands. The 3rd Expo brings together intellectual property rights holders (brands, content owners and designers) from different industries, as well as law enforcement and intellectual property protection experts from around the world.
2014 Post Davos Nordic Summit
February 17, 2014, The Grand Hotel, Stockholm, Sweden
The Summit is organised by PricewaterhouseCoopers, in association with the World Economic Forum and will once again bring together a select group of 100 of the region’s leading CEOs, chairmen and senior politicians, as well as speakers from around the world. The theme of the World Economic Forum Annual Meeting 2014 is: “The Reshaping of the World: Consequences for Politics, Business and Society”.
February 4-6, 2014, Phoenix Convention Center, Phoenix, AZ, USA
2014FLEX is a 4-day, multi-disciplinary event addressing global technical and business developments impacting the sector’s value and supply chains. The event draws over 600 professionals, representing 350 different organizations, for presentations, meetings, seminars and exhibits.
ODDO Midcap Forum
January 9-10, 2014, Lyon Convention Center, France
The Oddo Midcap Forum is the largest event of its kind exclusively for European listed companies with a market capitalisation of up to € 12bn. During 2 days, 165 companies and 281 investors will gather in 3291 meetings.
12th Anti-Counterfeiting & Brand Protection
West Coast Summit
January 27-29, 2014, Golden Gateway Hotel, San Francisco, CA, USA
At the cross-industry 12th Anti-Counterfeiting & Brand Protection West Coast Summit in San Francisco, you’ll learn from Brand Protection leaders, Trademark Counsel, IP Counsel, Investigators, and many others. These leading experts are trying to cripple counterfeit networks by implemented holistic anti-counterfeiting strategies and partnering with law enforcement around the world.
European Packaging Summit 2014
January 27-28, 2014, Maritim proArte Hotel, Berlin, Germany
The European Packaging Summit 2014 offers you the opportunity to explore innovative packaging strategies to reduce costs, it also gives access to the latest developments in packaging materials plus highlights creative ideas proven to grow your brand through packaging design. Taking place between January 27th-28th 2014, the summit delivers pre-qualified one-to-one meetings, technical workshops, interactive roundtables and keynote sessions with thought-leaders speaking about
Kai Leppanen, Thinfilm’s VP Sales and Business Development Eruope, will present in the session “Packaging Innovation Showcase”