Thinfilm has worldwide presence. Find us on the road.
March 2-5, 2015, Barcelona, Spain
The GSMA Mobile World Congress is a combination of the world’s largest exhibition for the mobile industry and a conference featuring prominent executives representing mobile operators, device manufacturers, technology providers, vendors and content owners from across the world. The event, initially named as GSM World Congress and later renamed as the 3GSM World Congress, is still often referred to as 3GSM or 3GSM World (Source: Wikipedia)
December 8, 2014, Brussels, Belgium
The new GSMA Mobile 360 Series offers senior executives in the mobile industry a platform to meet and discuss the key issues specific to a particular region or country. The events will include a thought leadership conference, a leadership forum, and networking opportunities. These events are designed for senior-level executives in mobile and adjacent industries, as well as key regulatory and government representatives.
November 2-5, 2014, Chicago, Illinois, USA
PACK EXPO International and the co-located Pharma EXPO is one of the largest packaging shows in the USA. Thinfilm is presenting at Active & Intelligent Packaging World Congress which is held in conjunction with PackExpo. Patty Britton, VP of Sales and Business Development North America, is presenting “Using Printed Electronics to Create a
Connected World ” at the event hosted by AIPIA, the Active and Intelligent Packaging Industry association.
November 6, 2014, Bern, Switzerland
Swiss Mobicamp, hosted by Swisscom is returning to Bern on 6th November and explores ‘What’s on the horizon for Mobile’? This autumn at Mobicamp we’ll provide you with authoritative insights into emerging mobile trends in areas such as The Internet of Things, automotive, mHealth, mobile payments and wearable computing.
Peter Fischer, Thinfilm’s Chief Product Officer, is presenting “Powering the Internet of Everything. Using Printed Electronics to Create a Truly Connected World” at this event.
November 12-13, 2014, Estancia La Jolla, UC San Diego, USA
November 19-20, 2014, Santa Clara, CA, USA
The world’s largest event on printed, organic and flexible electronics assesses end-user requirements, the latest diverse technology capability and all the opportunities. Over 200 exhibitors and 2,500 attendees are expected.