Thinfilm has worldwide presence. Find us on the road.


PackExpo InternationalPackExpo-PharmaExpo-Thinfilm-printed-electronics

November 2-5, 2014, Chicago, Illinois, USA

PACK EXPO International and the co-located Pharma EXPO is one of the largest packaging shows in the USA. Thinfilm is presenting at Active & Intelligent Packaging World Congress which is held in conjunction with PackExpo. Patty Britton, VP of Sales and Business Development North America, is presenting “Using Printed Electronics to Create a
Connected World ” at the event hosted by AIPIA, the Active and Intelligent Packaging Industry association.


Swiss MobicampSwiss mobicamp thinfilm printed electronics

November 6, 2014, Bern, Switzerland

Swiss Mobicamp, hosted by Swisscom is returning to Bern on 6th November and explores ‘What’s on the horizon for Mobile’? This autumn at Mobicamp we’ll provide you with authoritative insights into emerging mobile trends in areas such as The Internet of Things, automotive, mHealth, mobile payments and wearable computing.
Peter Fischer, Thinfilm’s Chief Product Officer, is presenting “Powering the Internet of Everything. Using Printed Electronics to Create a Truly Connected World” at this event.


TSensors (Trillion Sensors) Summit San DiegoTSensor Summit LaJolla Thinfilm

November 12-13, 2014, Estancia La Jolla, UC San Diego, USA


IDTechEx Printed Electronics USA 2014Thinfilm-PE-USA-2014-IDTechEx-logo

November 19-20, 2014, Santa Clara, CA, USA

The world’s largest event on printed, organic and flexible electronics assesses end-user requirements, the latest diverse technology capability and all the opportunities. Over 200 exhibitors and 2,500 attendees are expected.


Previous events:


TC3: Telecom Council Carrier Connections 2014TC3 council Thinfilm

October 1-2, 2014, Mountain View, CA, US

The Telecom Council of Silicon Valley is Where Telecom Meets Innovation. Last year, The Telecom Council connected over 1,000 executives from 500 telecom companies and 25 fixed and wireless carriers across 40 meeting topics. By joining, speaking, sponsoring, or simply participating in a meeting, there are many ways telecom companies of any size can use the Telecom Council network.


The Marcus Wallenberg Prize SymposiumMarcus-Wallenberg-Price-Thinfilm-printed-electronics-Magnus-Bergren

September 23, 2014, Grand Hôtel Stockholm, Sweden

The purpose of the Prize is to recognize, encourage and stimulate pathbreaking scientific achievements which contribute significantly to broadening knowledge and to technical development within the fields of importance to forestry and forest industries. The 2014 Marcus Wallenberg Prize of SEK 2 million is being awarded to Professor Magnus Berggren at Linköping University for his pioneering research which has made it much easier to print electronics, such as sensors and displays, on paper and cardboard. This opens up a new huge global market for the forest industry. 

Prof. Bergren is member of Thinfilm’s Technical Advisory Council. Ms. Jennifer Ernst, executive vice president, sales and business development, at Thinfilm is invited to speak at the award ceremony.


2nd China High-end Packaging and Brand Innovation SummitNoppen event China Packaging Thinfilm

September 18-19, 2014, Shanghai, China

The 2nd China High End Packaging and Brand Innovation Summit will take place on September 18-19, 2014 in Shanghai, China. This event will draw senior officials and presidents from government bodies and industry associations along with presidents, chief designers, brand directors, strategy director, marketing directors and project directors from major manufactures of cosmetics, perfume, jewellery, watch, clothes and other prestige goods, packaging design institutes, brand innovation enterprise and consulting agency.


TSensors (Trillion Sensors) Summit MunichTSensor Summit Munich Thinfilm

September 15 – 17, 2014, Sheraton München Arabellapark Hotel, Germany

TSensors Summits are being organized as forums for the world’s sensor visionaries to present their views on which sensor applications (TApps), sensor types and sensor manufacturing platforms which have the potential to fuel sensor market growth to the trillions within a decade. Such forecasted explosion will be a continuation of consumer sensor growth from 10 million units in 2007 (iPhone introduction) to almost 10 billion devices in 2013.

Thinfilm’s CEO Davor Sutija’s talk, “Affordable Scaling of Sensor Manufacturing with Printed Electronics”, will be featured in the Flexible Electronics Manufacturing session.


Labelexpo Americas 201labelexpo2014-america

September 9-11, 2014, Rosemont, Illinois, US

Labelexpo Americas is the continent’s largest event for the label, product decoration, web printing and converting industry.


IDTechEx Business and Technology Insight ForumsIDTechEx-logo-colour

September 3-4, 2014, UDX Conference Center, Tokyo, Japan

Foour half-day summits providing critical business intelligence covering: Technology assessment and forecasts, Market assessment and forecasts, Key players and player assessment, Case studies and application trends, Industry structure, value chain and opportunities. Forum topics: Flexible Sensors and Displays, Transparent Conductive Films, 3D Printing, Electrics Vehicles.


Steinbeck Innovation / AgTech summit 2014Steinbeck Innovation Thinfilm

July 9, 2014, The Monterey Plaza Hotel, Monterey, CA, US

Steinbeck Innovation Summit”, a very special gathering of the top leaders in Agriculture, Innovation and Investment. With the top Agricultural leaders from Taylor Farms, Dole Foods, Chiquita, Mann Packing as well as Silicon Valley leaders from IBM, Cisco, Intel, Google and more.


LOPEC 2014 – International Exhibition and Conference LOPEC-Munich-Conference-logo
for the Printed Electronics Industry

May 26-28, 2014, Messe München, Munich, Germany

LOPEC is the leading international trade fair and conference for printed electronics in the high-tech business location of Munich. The exclusive business platform addresses manufacturers and users of a technology of the future across a wide range of industry sectors. It is innovative, flexible, cost-effective and thus suitable for mass-market production.


Interpack 2014 – Processes and PackagingThinfilm Interpack logo

May 8-14, 2014, Messe Düsseldorf, Düsseldorf, Germany

As the world’s leading trade fair, it is the major inspiration for the packaging industry and all related process technologies.

2,700 exhibitors from more than 60 countries will present their latest ideas, innovate concepts and technological visions at interpack – not only in equipment and machinery for packaging and processing, but also in production tools for packaging materials, materials themselves, and services for the entire industry.

PEPSO Interpack Thinfilm

PEPSO Global is the new information platform for printed and organic electronics. Inform yourself about the newest trends and developments concerning printed electronics in the glass and solar industry, medical technology, retail technology, plastics industry and printing technology.

www.pepso-global.comuope, will present in the session “Packaging Innovation Showcase”